BO'LAJAK MUHANDISLARNING KASBIY KOMPETENTLIGINI SHAKLLANTIRISHDA VIRTUAL LABORATORIYA KOMPLEKSLARINING DIDAKTIK IMKONIYATLARI
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Abstract
Maqolada bo‘lajak muhandislarning kasbiy kompetentligini shakllantirishda virtual laboratoriya komplekslarining didaktik imkoniyatlari yoritilgan. Virtual muhitning nazariya va amaliyotni integratsiyalash, texnik jarayonlarni vizuallashtirish, mustaqil ta’lim va tahliliy fikrlashni rivojlantirishdagi o‘rni asoslangan. Shuningdek, virtual laboratoriya mashg‘ulotlarini tashkil etishning asosiy didaktik tamoyillari va bosqichlari tavsiflangan.
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Muslimov N.A. Kasb ta’limi o‘qituvchilarini kasbiy kompetentligini shakllantirish texnologiyasi. – T.: Fan va texnologiya, 2013. – 128 b.
Brinson J.R. Learning outcome achievement in non-traditional (virtual and remote) versus traditional (hands-on) laboratories: A review of the empirical research // Computers & Education. – 2015. – Vol. 87. – P. 218–237.
Nemtinov V., Borisenko A., Morozov V., Nemtinova Yu.V. Increasing the Level of Professional Competence Using a Virtual Educational Environment // Vysshee Obrazovanie v Rossii = Higher Education in Russia. – 2021. – Vol. 30. – P. 104–113.
Potkonjak V., Gardner M., Callaghan V., Mattila P., Guetl C., Petrović V.M., Jovanović K. Virtual laboratories for education in science, technology, and engineering: A review // Computers & Education. – 2016. – Vol. 95. – P. 309–327.
Kanukov S.G., Khatagov A.Ch. Concepts of Creating a Virtual Laboratory Module within the Software of Computer Simulators Intended for Training Future Engineers // Modeling of Artificial Intelligence. – 2014. – Vol. 2, No. 2. – P. 66–71.
Gustavsson I. et al. On Objectives of Instructional Laboratories, Individual Assessment, and Use of Collaborative Remote Laboratories // IEEE Transactions on Learning Technologies. – 2009. – Vol. 2, No. 4. – P. 263–274.